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Exploited. On CISA's list since 2023-12-05.
CVE-2023-33063 · Qualcomm Multiple Chipsets · Published 2023-12-05
7.8 out of 10
CVSS rates it high.
0.7%
Estimated chance of exploitation in the next 30 days, higher than 51% of all scored flaws (EPSS, 2026-10-29).
Yes
CISA has seen it exploited in real attacks. For US government agencies the fix is deadline passed 1039 days ago (2023-12-26).
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Memory corruption in DSP Services during a remote call from HLOS to DSP.
From the NVD.
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Understand the kind of weakness behind this flaw. These resources teach the weakness, rather than reproduce this specific CVE. Follow the vendor's advice above to fix the affected product.
A program uses memory after releasing it, when its contents may belong to something else.
CWE-416 · CISA KEV; NVD record: nvd@nist.gov; NVD record: product-security@qualcomm.com
Practice labs · Free account. Requires C, pointers and basic binary exploitation; begin with Freebie (Easy).
CWE is a catalogue of weakness types. Labels come from the sources shown and can differ or change. Resource matches reviewed 16 October 2026.
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Exploited flaws from CISA's KEV catalogue. Chance of exploitation from EPSS by FIRST. Descriptions and scores from the NVD. This product uses the NVD API but is not endorsed or certified by the NVD.